Stealth Dicing(隐形切割)技术是一种使用激光的激光切割技术,具有全新的概念。由于“完全干燥工艺”、“无截口损失”、“无切屑”、“高弯曲强度”等特点,该技术适用的器件范围将扩大到包括 MEMS 器件和存储器件等。
SDBG(研磨前隐形切割)是我们提供的晶圆切割工艺,以提高厚度小于 50 µm 的超薄芯片设备的结构强度。在 SDBG 工艺中,首先会使用激光光束照射晶圆,以便在晶圆内部形成改性层(隐形切割层或 SD 层)和裂纹,然后通过研磨和抛光使晶圆变薄。由于也会通过研磨和抛光而去除 SD 层,因此可以消除会降低芯片设备结构强度的潜在有害因素,以便能制造具有高质量和高强度的超薄芯片。
SDBG 工艺也非常适用于具有 DAF(芯片贴装薄膜)的晶圆,以及具有堆叠图案(包括低 k(低介电常数)薄膜)的硅晶圆。
2. 激光辐射
SD 层处于 BHC (*4) 状态。
3. 研磨和抛光
也可通过研磨和抛光去除 SD 层。
5. 扩展
DAF (*3) 也在扩展过程中遭到分割。
(无需进行 DAF(*3) 处理。)
注意:流程可能因设备而异。
为了提高 SDBG 工艺的实用性与有用性,隐形切割技术采用了称为 LBA(激光光束调节器)的光学系统,该系统专为使用我们内部开发的 LCOS-SLM(硅基液晶 - 空间光调制器)进行隐形切割而设计。LCOS-SLM 是反射型空间光调制器,可以自由调制光的相位,并在其液晶表面上显示所需的任何图案,从而能根据用户用途实现高质量、高通量的激光处理。
激光光束会由扩束器扩展到最佳形状,并照射在显示所需任何图案的 LCOS-SLM 上。接下来,激光光束由 LCOS-SLM 内的压控液晶进行相位调制,并通过图像传输光学系统,从中将波前形状的图像传输到物镜表面。然后光束将通过物镜,聚焦在晶圆内部。
LBA 可以校正聚焦在晶圆内部的激光光束,或将其分割成多个激光光束,以获得最佳的激光切割效果。例如,像差校正能改善光束聚焦性能,这会扩展源自 SD 层的裂纹,从而减少所需 SD 层的数量。通过多点同步处理,可以将物镜发射的激光光束分割成多个光束,从而沿晶圆厚度方向同时形成多个 SD 激光光束。可以对分割后的每个激光光束进行控制,以便进行像差校正,并根据切割深度对激光输出比进行调整。在需要时,也可以将激光光束在激光光束扫描方向分割成多个光束,以便能使用低频激光进行高速处理,或能提高同步处理期间的切割质量。
(红色:SD 层/白色:裂纹)
(红色:SD 层/白色:裂纹)
注意:激光光束聚焦图是图像。
隐形切割技术开发于大约 20 年前。从那时起,凭借激光器和光学系统的持续改进,隐形切割技术的用途得以扩展,已经涵盖各种设备与材料。最近,存储设备的大规模生产已经开始使用 SDBG 工艺,这是隐形切割技术最初的开发目标。
使用我们先进的隐形切割技术时,请注意,还应预先查看增值处理的许多专利。下表展示了我们目前持有的 SDBG 工艺专利,以及专为隐形切割而设计的相关 LBA 光学系统的专利。
国家/地区 | SDBG 工艺 (研磨前隐形切割) 专利号 |
隐形切割专用光学系统 LBA(激光光束调节器) 专利号 |
---|---|---|
日本 | 4995256,4358762,3762409,4781661,4563097 | 5863891,6258787,5575200,5255109,5479925, 5148575,5692969,5599563,4402708,5775265, 5844089 |
美国 | 8268704,7566635,8304325,8314013,8518800, 8518801,8519511,8889525,9142458,9287177, 9711405,9553023,9548246,9543207,9543256, 10068801,10622255,7939430,8058103,8551817 |
8134099,9428413,10622254,10328521,8755107, 8526091,9415461,9488831,10324285,8610993, 8441709,9001411 |
韩国 | 10-0715576,10-0848408,10-1283294,10-0827879 | 10-1013286,10-1212936,10-1302336,10-1402475, 10-1711247,10-1564523,10-1711311,10-2303178, 10-1839439,10-1708066,10-1708161,10-1605219, 10-1577096 |
中国 | ZL03805866.9,ZL200510085444.0, ZL200610164347.5,ZL200610164346.0, ZL200710182348.7,ZL200580038895.7, ZL200480026066.2 |
ZL200880101826.X,ZL201010525444.9, ZL201210046724.0,ZL201410002145.5, ZL201580028164.8,ZL201180007586.9, ZL200980134183.3,ZL201410406348.0, ZL200980152729.8,ZL200980152900.5 |
台湾 | I278027,I363665,I321828 | I394627,I573649,I595953,I638697,I515065, I524958 |
德国 | 60339137.0,60337873.0,60313900.0,60350530.9, 60350449.3,60352263.7,602005045636.8, 602004031963.5 |
602008044635.2,602009051537.3,602009041607.3, 602009041757.6 |
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